Direct electroplated metallization on indium tin oxide plastic substrate.
Identifieur interne : 000214 ( Main/Exploration ); précédent : 000213; suivant : 000215Direct electroplated metallization on indium tin oxide plastic substrate.
Auteurs : RBID : pubmed:24380434Abstract
Looking foward to the future where the device becomes flexible and rollable, indium tin oxide (ITO) fabricated on the plastic substrate becomes indispensable. Metallization on the ITO plastic substrate is an essential and required process. Electroplating is a cost-effective and high-throughput metallization process; however, the poor surface coverage and interfacial adhesion between electroplated metal and ITO plastic substrate limits its applications. This paper develops a new method to directly electroplate metals having strong adhesion and uniform deposition on an ITO plastic substrate by using a combination of 3-mercaptopropyl-trimethoxysilane (MPS) self-assembled monolayers (SAMs) and a sweeping potential technique. An impedance capacitive analysis supports the proposed bridging link model for MPS SAMs at the interface between the ITO and the electrolyte.
DOI: 10.1021/la404552c
PubMed: 24380434
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<record><TEI><teiHeader><fileDesc><titleStmt><title xml:lang="en">Direct electroplated metallization on indium tin oxide plastic substrate.</title><author><name sortKey="Hau, Nga Yu" uniqKey="Hau N">Nga Yu Hau</name><affiliation wicri:level="1"><nlm:affiliation>Department of Mechanical Engineering, The University of Hong Kong , Pokfulam, Hong Kong.</nlm:affiliation><country xml:lang="fr">Hong Kong</country><wicri:regionArea>Department of Mechanical Engineering, The University of Hong Kong , Pokfulam</wicri:regionArea></affiliation></author><author><name sortKey="Chang, Ya Huei" uniqKey="Chang Y">Ya-Huei Chang</name></author><author><name sortKey="Huang, Yu Ting" uniqKey="Huang Y">Yu-Ting Huang</name></author><author><name sortKey="Wei, Tzu Chien" uniqKey="Wei T">Tzu-Chien Wei</name></author><author><name sortKey="Feng, Shien Ping" uniqKey="Feng S">Shien-Ping Feng</name></author></titleStmt><publicationStmt><date when="2014">2014</date><idno type="doi">10.1021/la404552c</idno><idno type="RBID">pubmed:24380434</idno><idno type="pmid">24380434</idno><idno type="wicri:Area/Main/Corpus">000229</idno><idno type="wicri:Area/Main/Curation">000229</idno><idno type="wicri:Area/Main/Exploration">000214</idno></publicationStmt></fileDesc><profileDesc><textClass></textClass></profileDesc></teiHeader><front><div type="abstract" xml:lang="en">Looking foward to the future where the device becomes flexible and rollable, indium tin oxide (ITO) fabricated on the plastic substrate becomes indispensable. Metallization on the ITO plastic substrate is an essential and required process. Electroplating is a cost-effective and high-throughput metallization process; however, the poor surface coverage and interfacial adhesion between electroplated metal and ITO plastic substrate limits its applications. This paper develops a new method to directly electroplate metals having strong adhesion and uniform deposition on an ITO plastic substrate by using a combination of 3-mercaptopropyl-trimethoxysilane (MPS) self-assembled monolayers (SAMs) and a sweeping potential technique. An impedance capacitive analysis supports the proposed bridging link model for MPS SAMs at the interface between the ITO and the electrolyte.</div></front></TEI><pubmed><MedlineCitation Owner="NLM" Status="In-Process"><PMID Version="1">24380434</PMID><DateCreated><Year>2014</Year><Month>01</Month><Day>14</Day></DateCreated><Article PubModel="Print-Electronic"><Journal><ISSN IssnType="Electronic">1520-5827</ISSN><JournalIssue CitedMedium="Internet"><Volume>30</Volume><Issue>1</Issue><PubDate><Year>2014</Year><Month>Jan</Month><Day>14</Day></PubDate></JournalIssue><Title>Langmuir : the ACS journal of surfaces and colloids</Title><ISOAbbreviation>Langmuir</ISOAbbreviation></Journal><ArticleTitle>Direct electroplated metallization on indium tin oxide plastic substrate.</ArticleTitle><Pagination><MedlinePgn>132-9</MedlinePgn></Pagination><ELocationID EIdType="doi" ValidYN="Y">10.1021/la404552c</ELocationID><Abstract><AbstractText>Looking foward to the future where the device becomes flexible and rollable, indium tin oxide (ITO) fabricated on the plastic substrate becomes indispensable. Metallization on the ITO plastic substrate is an essential and required process. Electroplating is a cost-effective and high-throughput metallization process; however, the poor surface coverage and interfacial adhesion between electroplated metal and ITO plastic substrate limits its applications. This paper develops a new method to directly electroplate metals having strong adhesion and uniform deposition on an ITO plastic substrate by using a combination of 3-mercaptopropyl-trimethoxysilane (MPS) self-assembled monolayers (SAMs) and a sweeping potential technique. An impedance capacitive analysis supports the proposed bridging link model for MPS SAMs at the interface between the ITO and the electrolyte.</AbstractText></Abstract><AuthorList CompleteYN="Y"><Author ValidYN="Y"><LastName>Hau</LastName><ForeName>Nga Yu</ForeName><Initials>NY</Initials><Affiliation>Department of Mechanical Engineering, The University of Hong Kong , Pokfulam, Hong Kong.</Affiliation></Author><Author ValidYN="Y"><LastName>Chang</LastName><ForeName>Ya-Huei</ForeName><Initials>YH</Initials></Author><Author ValidYN="Y"><LastName>Huang</LastName><ForeName>Yu-Ting</ForeName><Initials>YT</Initials></Author><Author ValidYN="Y"><LastName>Wei</LastName><ForeName>Tzu-Chien</ForeName><Initials>TC</Initials></Author><Author ValidYN="Y"><LastName>Feng</LastName><ForeName>Shien-Ping</ForeName><Initials>SP</Initials></Author></AuthorList><Language>eng</Language><PublicationTypeList><PublicationType>Journal Article</PublicationType></PublicationTypeList><ArticleDate DateType="Electronic"><Year>2013</Year><Month>12</Month><Day>31</Day></ArticleDate></Article><MedlineJournalInfo><Country>United States</Country><MedlineTA>Langmuir</MedlineTA><NlmUniqueID>9882736</NlmUniqueID><ISSNLinking>0743-7463</ISSNLinking></MedlineJournalInfo></MedlineCitation><PubmedData><History><PubMedPubDate PubStatus="aheadofprint"><Year>2013</Year><Month>12</Month><Day>31</Day></PubMedPubDate><PubMedPubDate PubStatus="entrez"><Year>2014</Year><Month>1</Month><Day>2</Day><Hour>6</Hour><Minute>0</Minute></PubMedPubDate><PubMedPubDate PubStatus="pubmed"><Year>2014</Year><Month>1</Month><Day>2</Day><Hour>6</Hour><Minute>0</Minute></PubMedPubDate><PubMedPubDate PubStatus="medline"><Year>2014</Year><Month>1</Month><Day>2</Day><Hour>6</Hour><Minute>0</Minute></PubMedPubDate></History><PublicationStatus>ppublish</PublicationStatus><ArticleIdList><ArticleId IdType="doi">10.1021/la404552c</ArticleId><ArticleId IdType="pubmed">24380434</ArticleId></ArticleIdList></PubmedData></pubmed></record>Pour manipuler ce document sous Unix (Dilib)
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